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BD055 - 1.27mm pitch Socket Board to Board Connector

  • BD055 3D Render
    BD055 3D Render
  • BD055 3D Render
Series: BD055
Product Status: Active
Product Family: Board to Board Connector
Pitch: 1.27mm
Gender: Socket
Number of Contacts: 04-100
PCB Mount type: Surface mount
Number of Rows: Dual
Elevated: No
Orientation: Straight
Square Pin Size: 0.40mm
Profile: 3.60mm
Insulator Colour: Black
Entry Type: Top entry
Locating Peg: Optional locating peg

Product Resources

  • Resource Files Not Available for BD055

    No resource files have been created for this series yet.

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    Request PCB Model

  • Material

    Contact Material: Copper Alloy
    Standard Insulator Material: Polyester LCP, UL94 V-0

    Plating

    Underplating: 50-100µ" Nickel
    Where specified tin plating thickness 80µ" minimum
    Contact Plating: Gold Flash, Selective Gold Flash, Tin

    Electrical

    Current Rating: 1 AMP
    Contact Resistance: 20mΩ Max.
    Insulation resistance: 1000 MΩ MIN.
    Dielectric withstanding voltage: AC 300 V

    Environmental and Processing

    Operating Temperature: -40°C to +105°C
    LCP Suitable For: IR Reflow, Wave, Manual solder
  • Product Change Notice for BD055

    GCT BD055 H PCN 20140908.pdf

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