BD030 - 1.27mm pitch Header Board to Board Connector

  • BD030 3D Render
    BD030 3D Render

    Product overview

    Active
    Series BD030
    Product FamilyBoard to Board Connector
    Pitch1.27mm
    GenderHeader
    Number of Contacts04-66
    PCB Mount typeThrough Hole
    Number of RowsDual
    ElevatedNo
    OrientationStraight
    Square Pin Size0.40mm
    Profile1.00mm, 1.50mm, 1.70mm, 2.00mm, 2.50mm, 3.00mm
    Insulator ColourBlack
    Locating PegWithout
    Add series to basket -Buy from NewarkProduct DrawingGo to PCB Model Section

    Product Resources

    • Resource Files Not Available for BD030

      No resource files have been created for this series yet.

    • Material

      Contact Material: Copper Alloy
      Standard Insulator Material: Polyester LCP, UL94 V-0

      Plating

      (A) Finish: Gold Flash All Over - Under Plate: Nickel 30-50µ”
      (B) Finish: Selective gold flash contact area/tin on tail - Under Plate: Nickel 50-100µ”
      (C) Finish: Tin All Over – 80µ” minimum – Under Plate: Nickel 30-50µ”
      (G&I) Finish: Gold 10µ” (G) or 30µ” (I) on contact area. Tin 100µ” minimum on tail - Under Plate: Nickel 50-100µ”

      Electrical

      Current Rating: 1 AMP
      Contact Resistance: 20mΩ Max.
      Insulation resistance: 1000 MΩ MIN.
      Dielectric withstanding voltage: AC 300 V

      Environmental and Processing

      Operating Temperature: -40°C to +105°C - (Contact GCT if you require temperatures outside this range)
      LCP Suitable For: IR Reflow, Wave, Manual solder