BD040 - 1.27mm pitch Header Board to Board Connector

Product Resources

• You can find all available models for the selected series below.

  20 contacts

  BD040-20-X-X-XXXX-XXXX-X-X

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• Material

  Contact Material: Copper Alloy
  Standard Insulator Material: Polyester LCP, UL94 V-0
  Optional insulator material: Polyamide Nylon 6T, UL94 V-0
  

  Plating

  (A) Finish: Gold Flash All Over - Under Plate: Nickel 30-50µ”
  (B) Finish: Selective gold flash contact area/tin on tail - Under Plate: Nickel 50-100µ”
  (C) Finish: Tin All Over – 80µ” minimum – Under Plate: Nickel 30-50µ”
  (G&I) Finish: Gold 10µ” (G) or 30µ” (I) on contact area. Tin 100µ” minimum on tail - Under Plate: Nickel 50-100µ”
  

  Electrical

  Current Rating: 1 AMP
  Contact Resistance: 20mΩ Max.
  Insulation resistance: 1000 MΩ MIN.
  Dielectric withstanding voltage: AC 300 V
  

  Environmental and Processing

  Operating Temperature: -40°C to +105°C - (Contact GCT if you require temperatures outside this range)
  LCP Suitable For: IR Reflow, Wave, Manual solder
  Nylon 6T Suitable For: IR Reflow, Wave, Manual solder