BD074 - 1.27mm pitch Socket Board to Board Connector

Product Resources

• You can find all available models for the selected series below.

  18 contacts

  BD074-18-X-1-X-X

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• Material

  Contact Material: Copper Alloy
  Standard Insulator Material: Polyester LCP, UL94 V-0
  

  Plating

  Underplating: 50-100µ" Nickel
  Where specified tin plating thickness 80µ" minimum
  Contact Plating: Gold Flash, Selective Gold Flash, Tin, 10µ" Selective Gold, 30µ" Selective Gold
  

  Electrical

  Current Rating: 1 AMP
  Contact Resistance: 20mΩ Max.
  Insulation resistance: 1000 MΩ MIN.
  Dielectric withstanding voltage: AC 300 V
  

  Environmental and Processing

  Operating Temperature: -40°C to +105°C - (Contact GCT if you require temperatures outside this range)
  LCP Suitable For: IR Reflow, Manual solder