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BD100 - 1.27mm pitch Header Board to Board Connector

BD100 3D Render

Series: BD100

Product Status: Active

Product Family: Board to Board Connector
Pitch: 1.27mm
Gender: Header
Number of Contacts: 02-33
PCB Mount type: Through hole
Number of Rows: Single
Elevated: No
Orientation: Right angle
Square Pin Size: 0.40mm
Profile: 2.50mm
Insulator Colour: Black
Locating Peg: Without locating peg

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Material
Contact Material: Copper Alloy
Standard Insulator Material: Polyester LCP, UL94 V-0
Optional insulator material: Polyamide Nylon 6T, UL94 V-0
Plating
(A) Finish: Gold Flash All Over - Under Plate: Nickel 30-50µ”
(B) Finish: Selective gold flash contact area/tin on tail - Under Plate: Nickel 50-100µ”
(C) Finish: Tin All Over – 80µ” minimum – Under Plate: Nickel 30-50µ”
(G&I) Finish: Gold 10µ” (G) or 30µ” (I) on contact area. Tin 100µ” minimum on tail - Under Plate: Nickel 50-100µ”
Electrical
Current Rating: 1 AMP
Contact Resistance: 20mΩ Max.
Insulation resistance: 1000 MΩ MIN.
Dielectric withstanding voltage: AC 300 V
Environmental and Processing
Operating Temperature: -40°C to +105°C - (Contact GCT if you require temperatures outside this range)
LCP Suitable For: IR Reflow, Wave, Manual solder
Nylon 6T Suitable For: IR Reflow, Wave, Manual solder