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BD100 - 1.27mm pitch Header Board to Board Connector

  • BD100 3D Render
    BD100 3D Render
  • BD100 3D Render
Series: BD100
Product Status: Active
Product Family: Board to Board Connector
Pitch: 1.27mm
Gender: Header
Number of Contacts: 02-33
PCB Mount type: Through hole
Number of Rows: Single
Elevated: No
Orientation: Right angle
Square Pin Size: 0.40mm
Profile: 2.50mm
Insulator Colour: Black
Locating Peg: Without locating peg

Product Resources

  • Resource Files Not Available for BD100

    No resource files have been created for this series yet.

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  • Material

    Contact Material: Copper Alloy
    Standard Insulator Material: Polyester LCP, UL94 V-0
    Optional insulator material: Polyamide Nylon 6T, UL94 V-0

    Plating

    (A) Finish: Gold Flash All Over - Under Plate: Nickel 30-50µ”
    (B) Finish: Selective gold flash contact area/tin on tail - Under Plate: Nickel 50-100µ”
    (C) Finish: Tin All Over – 80µ” minimum – Under Plate: Nickel 30-50µ”
    (G&I) Finish: Gold 10µ” (G) or 30µ” (I) on contact area. Tin 100µ” minimum on tail - Under Plate: Nickel 50-100µ”

    Electrical

    Current Rating: 1 AMP
    Contact Resistance: 20mΩ Max.
    Insulation resistance: 1000 MΩ MIN.
    Dielectric withstanding voltage: AC 300 V

    Environmental and Processing

    Operating Temperature: -40°C to +105°C
    LCP Suitable For: IR Reflow, Wave, Manual solder
    Nylon 6T Suitable For: IR Reflow, Wave, Manual solder

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