Underplating: 50-100µ" Nickel Where specified tin plating thickness 80µ" minimum Contact Plating: Gold Flash, Selective Gold Flash, Tin
Electrical
Current Rating: 2 AMP Contact Resistance: 20mΩ Max. Insulation resistance: 1000 MΩ MIN. Dielectric withstanding voltage: AC 500 V
Environmental and Processing
Operating Temperature: -40°C to +105°C LCP Suitable For: IR Reflow, Wave, Manual solder High Temperature Nylon Suitable For: IR Reflow, Wave, Manual solder