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BG200 - 2.54mm pitch Socket Board to Board Connector

  • BG200 3D Render
    BG200 3D Render
  • BG200 3D Render
Series: BG200
Product Status: Active
Product Family: Board to Board Connector
Pitch: 2.54mm
Gender: Socket
Number of Contacts: 04-80
PCB Mount type: Surface mount
Number of Rows: Dual
Elevated: No
Orientation: Right angle
Square Pin Size: 0.64mm
Profile: 6.10mm
Insulator Colour: Black
Locating Peg: Without locating peg

Board to Board First Mate Last Break

Product Resources

  • Resource Files Not Available for BG200

    No resource files have been created for this series yet.

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    Request PCB Model

  • Material

    Contact Material: Copper Alloy
    Standard Insulator Material: Polyamide Nylon 6T, UL94 V-0
    Optional insulator material: Polyester LCP, UL94 V-0

    Plating

    Underplating: 50-100µ" Nickel
    Where specified tin plating thickness 80µ" minimum
    Contact Plating: Gold Flash, Selective Gold Flash, Tin, 10µ" Gold, 30µ" Gold

    Electrical

    Current Rating: 3 AMP
    Contact Resistance: 20mΩ Max.
    Insulation resistance: 1000 MΩ MIN.
    Dielectric withstanding voltage: AC 600 V

    Environmental and Processing

    Operating Temperature: -40°C to +105°C - (Contact GCT if you require temperatures outside this range)
    LCP Suitable For: IR Reflow, Wave, Manual solder
    Nylon 6T Suitable For: IR Reflow, Wave, Manual solder
  • Product Change Notice for BG200

    GCT BG200 E PCN 20150722.pdf

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