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USB3180 - Micro USB 2.0 Connector

  • USB3180 3D Render
    USB3180 3D Render
  • 3D Model Preview for USB3180-30-C
  • USB3180 3D render reverse
    USB3180 3D render reverse
  • USB3180 Front view render
    USB3180 Front view render
  • USB3180 Back view render
    USB3180 Back view render
  • USB3180 Side view render
    USB3180 Side view render
  • USB3180 Top view render
    USB3180 Top view render
  • USB3180 Bottom view render
    USB3180 Bottom view render
  • USB3180 3D Render
  • 3D Model Preview
  • USB3180 360 rotate
  • USB3180 3D render reverse
  • USB3180 Front view render
  • USB3180 Back view render
  • USB3180 Side view render
  • USB3180 Top view render
  • USB3180 Bottom view render
Series: USB3180
Product Status: Active
Product Family: USB 2.0 Connector
Enhanced stability on PCB with four shell stakes
Connector style: Micro
Interface: B
USB version: 2.0
Gender: Receptacle
Number of contacts: 5
PCB mount type: Surface mount
Orientation: Vertical
Entry type: Top
Profile: 6.50mm
Current Rating: 1.8A
Mating face style: With mating face lead in
Shell stake: Through hole
Shell stake lengths: 1.70mm (for 1.00mm PCB)
Locating Peg: With locating peg
Mating Cycles: 10000

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Product Resources

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    By clicking continue, you understand that you will be redirected to our partners website (www.snapeda.com) to view the PCB layout files available in different formats.

  • Material

    Contact Material: Copper Alloy
    Housing Material:  LCP, UL94V-0, black
    Contact Terminal: Copper Alloy
    Metallic Shell: Stainless steel

    Plating

    Contact Terminal
    Underplating: 50µ" Nickel all over
    Contact Plating: 30µ" Gold
    Solder Tail: Gold Flash
    Metallic Shell: Matte Tin over 50µ" Nickel

    Electrical

    Voltage Rating: 30V AC
    Current Rating: Signal (Pins 2,3,4): 1.0A, Power (Pins 1,5): 1.8A
    Contact Resistance: 30mΩ Max
    Insulation resistance: 1000MΩ Min.
    Dielectric withstanding voltage: 500V AC/Minute

    Mechanical

    Durability: 10,000 cycles
    Mating Force: 35N (3.57Kgf) Max
    Unmating Force: Initial - 10N Max, Final 8 - 25N after durability test

    Environmental and Processing

    Operating Temperature: -30°C to +85°C
    Solder Temperature: Peak temp 260°C (+0/-5°C) Maximum (10 seconds)

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