BG055 - 2.54mm pitch Header Board to Board Connector

  • BG055 3D Render
    BG055 3D Render
  • BG055 3D Render
Series: BG055
Product Status: Active
Product Family: Board to Board Connector
Pitch: 2.54mm
Gender: Header
Number of Contacts: 02-40
PCB Mount type: Surface mount
Number of Rows: Single
Elevated: No
Orientation: Straight
Square Pin Size: 0.64mm
Profile: Customer specifiable
Insulator Colour: Black
Locating Peg: Without locating peg

Board to Board First Mate Last Break

Product Resources

  • You can find all available models for the selected series below.

    03 contacts

    BG055-03X-X-XXXX-0530-XXXX-X-X

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    05 contacts

    BG055-05X-X-XXXX-0440-XXXX-X-X

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    BG055-05X-X-XXXX-0530-XXXX-X-X

    Download PCB Model

    External Site Disclaimer

    By clicking continue, you understand that you will be redirected to our partners website (www.snapeda.com) to view the PCB layout files available in different formats.

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  • Material

    Contact Material: Copper Alloy
    Standard Insulator Material: Polyamide Nylon 6T, UL94 V-0
    Optional insulator material: Polyester LCP, UL94 V-0 or Polyester PBT, UL94 V-0

    Plating

    (A) Finish: Gold Flash All Over - Under Plate: Nickel 30-50µ”
    (B) Finish: Selective gold flash contact area/tin on tail - Under Plate: Nickel 50-100µ”
    (C) Finish: Tin All Over – 80µ” minimum – Under Plate: Nickel 30-50µ”
    (G&I) Finish: Gold 10µ” (G) or 30µ” (I) on contact area. Tin 100µ” minimum on tail - Under Plate: Nickel 50-100µ”

    Electrical

    Current Rating: 3 AMP
    Contact Resistance: 20mΩ Max.
    Insulation resistance: 1000 MΩ MIN.
    Dielectric withstanding voltage: AC 600 V

    Environmental and Processing

    Operating Temperature: -40°C to +105°C - (Contact GCT if you require temperatures outside this range)
    LCP Suitable For: IR Reflow, Wave, Manual solder
    Nylon 6T Suitable For: IR Reflow, Wave, Manual solder

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