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USB1135 - Full size USB 3.0 Connector

  • USB1135 3D Render
    USB1135 3D Render
  • 3D Model Preview for USB1135-XX-X-X-B
  • USB1135 front view
    USB1135 front view
  • USB1135 top view
    USB1135 top view
  • USB1135 rear view
    USB1135 rear view
  • USB1135 bottom view
    USB1135 bottom view
  • USB1135 side view
    USB1135 side view
  • USB1135 3D Render
  • 3D Model Preview
  • USB1135 360 rotate
  • USB1135 front view
  • USB1135 top view
  • USB1135 rear view
  • USB1135 bottom view
  • USB1135 side view
Series: USB1135
Product Status: Active
Product Family: USB 3.0 Connector
20,000 Mating Cycle 3A USB 3.0
Connector style: Full size
Interface: A
USB version: 3.0
Gender: Receptacle
Number of contacts: 9
PCB mount type: Through hole
Orientation: Horizontal
Entry type: Side
Profile: 6.95mm
Mount position: Top mount
Current Rating: 3A
Mating face style: With mating face lead in
Shell stake: Through hole
Shell stake lengths: 3.84mm
Locating Peg: Without locating peg
Mating Cycles: 20000
Body Length: 16.50mm
Additional Information: High Mating cycle fast-charging USB A 3.0 and high traffic applications

Product Resources

  • External Site Disclaimer

    By clicking continue, you understand that you will be redirected to our partners website (www.snapeda.com) to view the PCB layout files available in different formats.

  • Material

    Contact Material: Copper Alloy
    Standard Insulator Material: PA9T, UL-94V-0, Blue
    Contact Terminal: Copper Alloy
    Metallic Shell: SUS304


    Contact Terminal
    Underplating: 50µ" Min. nickel all over
    Contact Plating: Gold Flash
    Contact Plating Options: 15µ" Gold
    Solder Tail: Tin 100µ"
    Metallic Shell: 50µ" Min. nickel all over


    Voltage Rating: 30V
    Current Rating: 3A
    Contact Resistance: 30mΩ Max (Power), 50mΩ Max (Signal)
    Insulation resistance: 100MΩ Min
    Dielectric withstanding voltage: 100V RMS for 1 minute between adjacent terminal, no breakdown


    Durability: 20,000 Cycles
    Mating Force: 35N (3.57Kgf) Max
    Unmating Force: Initial 10N (1.02Kgf) Min, Final 8N (0.82Kgf) Min.

    Environmental and Processing

    Operating Temperature: -55°C to +85°C
    Solder Temperature: Peak temp 260°C (+/-5°C) Maximum (5 seconds)

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