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USB3500 - IP67 Micro USB 2.0 Connector

  • USB3500 3D Render
    USB3500 3D Render
  • USB3500 Three Quarter Front
    USB3500 Three Quarter Front
  • USB3500 Three Quarter Back
    USB3500 Three Quarter Back
  • USB3500 Top
    USB3500 Top
  • USB3500 Bottom
    USB3500 Bottom
  • USB3500 Front
    USB3500 Front
  • USB3500 Back
    USB3500 Back
  • USB3500 Side
    USB3500 Side
  • USB3500 3D Render
  • USB3500 Three Quarter Front
  • USB3500 Three Quarter Back
  • USB3500 Top
  • USB3500 Bottom
  • USB3500 Front
  • USB3500 Back
  • USB3500 Side
Some images above show USB3500 with gasket USBTJ-02, ordered separately.
Series: USB3500
Product Status: Active
Product Family: USB 2.0 Connector
Waterproof IP67 Micro USB Connector
Connector style: Micro
Interface: B
USB version: 2.0
Gender: Receptacle
Waterproof: IP67
Number of contacts: 5
PCB mount type: Surface mount
Orientation: Horizontal
Entry type: Side
Profile: 4.90mm
Mount position: Mid mount
Mating face style: Without mating face lead in
Shell stake: Through hole
Locating Peg: With locating peg
Additional Information: For IP67 performance, USBTJ-02 gasket ordered separately.

  • USB3500
  • USB3500

Product Resources

  • USB3500-30-A

    External Site Disclaimer

    By clicking continue, you understand that you will be redirected to our partners website (www.snapeda.com) to view the PCB layout files available in different formats.

  • Material

    Contact Material: Copper Alloy
    Standard Insulator Material: High Temp Plastic
    Metallic Shell: Stainless Steel


    Metalic Shell
    Underplating: 50µ" - 80µ" Nickel all over
    Contact Plating: 30µ" Gold
    Solder Tail: 30µ" Gold
    Metallic Shell: Stainless Steel
    Fitting Nail: Stainless Steel


    Voltage Rating: 30V AC
    Current Rating: Signal (Pins 2,3,4): 1.0A, Power (Pins 1,5): 1.8A
    Contact Resistance: 30mΩ Max
    Insulation resistance: 1000MΩ Min
    Dielectric withstanding voltage: 100V AC


    Durability: 10,000 cycles
    Mating Force: 35N Max
    Unmating Force: 8N - 25N

    Environmental and Processing

    Operating Temperature: -30°C to +85°C
    Solder Temperature: Peak temp 260°C Maximum (10 seconds)

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