SIM6050 - Dual SIM Card Connector

Product Resources

• SIM6050-8-0-30-00-X

  Select PCB Format

  • Altium
  • Other

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• Material

  Housing Material: LCP 30% GF, UL94V-0, black
  Contact Terminal: Phosphor Bronze C5191R-EH, Thickness = 0.15mm, Phosphor Bronze C5210R-EH, Thickness = 0.15mm
  

  Plating

  Contact Terminal
  Underplating: Ni overall 50µ"
  Contact Plating: 3µ" Gold
  Solder Area: 1µ" Gold
  Metallic Shell
  Underplating: Ni overall 50µ"
  Solder Area: 1µ" Gold
  

  Electrical

  Voltage Rating: 30V
  Current Rating: 0.5 A Max
  Contact Resistance: 100mΩ max
  Insulation resistance: Apply 500VDC 100MΩ min
  Dielectric withstanding voltage: 200V AC min for 1 minute
  

  Mechanical

  Durability: 5,000 cycles
  Mating Force: 0.4kgf Max.
  Unmating Force: 0.5kgf Min.
  

  Environmental and Processing

  Operating Temperature: -40°C to +85°C
  Solder Temperature: 230°C for 30-60 sec, 260°C for 10 sec
  

• Product Change Notice for SIM6050

  GCT SIM6050 C PCN 20140326.pdf
  GCT SIM6050 D PCN 20181105.pdf